Silicon Ingot Slicing Beam for semiconductor
DWIZ BEAM S1
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Can be used for the BAND SAW and WIRE SAW processes for ingot slicing
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Customizable at customers' request
2”, 3”, 4”, 5”, 6”, 8”, 12”, 18”
Length : 50~650(mm)
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Simple to use, resulting in higher productivity and high-quality process
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Increased productivity as it is convenient to use adhesive on the product, the product design (including curved surfaces) is adhesive friendly