DOW BEAM

Basically, it can be used during the WIRE SAW process that is for slicing ingot; it can also be used during the DW process for producing thin wafer

Simple to use, resulting in higher productivity and high-quality process

Increased productivity as it is convenient to use adhesive on the product, the product design (including curved surfaces) is adhesive friendly

Customizable at customers' request

2”, 3”, 4”, 5”, 6”, 8”, 12”, 18”

Length : 50~650(mm)